Mainly used as a snubber resistor tocompensate the C-R peaks in traction power supplies.
General Characteristics
Electric support:
• High alumina ceramic metallized on the top sidewith EBG Metoxfilm placed on a solid A1 heatdistribution plate for perfect connection to themain heat sink.
Encapsulation:
• Special resin filled epoxy casing with largecreeping distance to mass, large air distancebetween the terminals and high insulationresistance (CTI 600).
Resistance Element:
• Special design for perfect current yield over theentire resistor area. Contacts:
• Easy load connecting with M4 or M5 screws.
• Connector height (M+N) available from 25 to42mm.
• Various sleeves for increased creepingdistance up to 85mm or potted cableconnections are available on special request.
• The model UXP 300 introduced on this pagecan be changed according to customers specification.
Please note that almost all of our UXPcustomers have their own custom designed drawing. Therefore please do not hesitate todiscuss your special need with the local representative of EBG. | Specifications
• Resistance Values:0.5W to 1MW
• Resistance Tolerance:±5% to ±10%
• Temperature Coefficient:±150ppm/°C (others upon request)
• Maximum Working Voltage:5,000VDC; higher voltage onrequest, not exceeding max. power
• Short Time Overload:1.5x rated power = 450W at70°C for 10 sec, DR = 0.4%max.
• Power Rating: 300W at 85°C bottom case temperature.
• Electric Strength Voltage:6kVrms, 50Hz, 1Min., up to 8,000Vrms on special request
• Single Shot Voltage: up to 12kV Normwave (1.5/50 µsec)
•Partial Discharge: 3kVrms<10pC, up to 5kV on special request
• Insulation Resistance:10GW Min. at 500V
• Creeping Distance: 42 mm Min.
• Air Distance:14 mm Minimum
• Inductance: - 80 nH
• Capacity/Mass: - 110 pF
• Capacity/Parallel: - 40 pF
• Operation Temperature:-55°C to +150°C
• Max. Torque for Contacts: 2 Nm
• Max. Torque for Mounting: 1.8 Nm M4 screws
• Dimensions: please see page 28 (datasheet UXP-600)! |
Derating (thermal resist.)
UXP 300: 4.36W/°K (0.229°K/W)
Power Rating: 300W at 85°C bottom case temp.*
*This value is only valid by using a thermal conduction to theheatsink Rth-cs<0.025°K/W.This value can be reached by using thermal transfer compoundwith a heat conductivity of 1W/mK. The flatness of the cooling plate must be better than 0.05mm overall. The roughness ofthe surface should not exceed 6.4µm. |
