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Series MP 35 TO 220

35 Watt Thick Film Power Resistors for High Frequency and Pulse Loading Applications




 The special performance features of the Type MXP include:
 •35 Watt power rating at 25°C
 •TO-220 package configuration
 •Single screw mounting simplifiesattachment to heat sink
 •Heat resistance to cooling plate:Rth< 4.28 °K/W
 •A molded case for environmentalprotection.
 •Resistor element is electrically insulatedfrom the metal sink tab.
 •Standard lead form for easier fit.

  



Dim.MillimeterInches
Min.Max.Min.Max.
A11.4313.970.4500.550
B16.0016.520.6300.650
C10.1510.670.4000.420
G1.141.400.0450.055
H2.544.060.1000.160
J0.660.860.0260.034
L4.825.340.1900.210
M2.923.440.1150.135
Q0.400.600.0160.124
R1.522.040.0600.080




Dim.Millimeter Inches
Min.Max.Min.Max.
A12.7014.700.5000.579
B14.5015.000.5710.591
C9.9110.410.3900.410
D3.553.750.1390.148
E5.856.350.2300.250
F2.853.050.1120.120
G1.171.370.0460.054
H- -4.00- -0.157
J0.700.860.0270.034
L4.835.330.1900.210
M4.064.820.1590.190
N1.201.400.0470.055
Q0.551.400.0220.028
R2.051.400.0800.089
 Specifications:
 •Resistance Range: 0.05W to1MW other values on request
 •Resistance Tolerance:±1%, ±2%, ±5%, ±10% (0.5% onrequest)
 •Temperature Coefficient:10W and above, ±50ppm/°C,referenced to 25°C, DR taken at+105°C. Between 1W and 10W,±(100ppm + 0.002W)/°C,referenced to 25°C, DR taken at+105°C
 •Max. Operating Voltage: 350V
 •Dielectric Strength: 1,800V AC
 •Power Rating:20W at 25°C. Depends uponcase temperature. See DeratingCurve.
 •Insulation Resistance:10GW min.
 •Momentary Overload:2 times rated power with appliedvoltage not to exceed 1.5 timesmaximum continuous operatingvoltage for 5 seconds, DR ± (0.3%+ 0.001W) max.
 •Load Life:MIL-R-39009, 2,000 hours atrated power, DR ±(1.0% +0.001W).
 •Moisture Resistance:MIL-Std-202, Method 106, DR±(0.5% + 0.001W) max.
 •Thermal Shock:MIL-Std-202, Method 107, Cond. F,DR ±(0.3% + 0.001W) max.
 •Terminal Strength:MIL-Std-202, Method 211, Cond. A(Pull Test) 2.4N, DR ±(0.2% + 0.001W)max.
 •Vibration, High Frequency:MIL-Std-202, Method 204, Cond. D,DR ±(0.2% + 0.001W) max.
 •Lead Material: Tinned Copper
 • For pulse power details, please  see page 27 (datasheet UXP-300)!












Derating (thermal resistance): 0.23W/°K (4.28°K/W).
Without a heatsink, when in free air at 25°C, the MXP is rated for 2.50W. Derating for temp. above 25°C is 0.02W/°K. 




The case temperature is to be used for the definitiion of the applied power limit.
The case temperature measurement must be made with a thermocouple contacting the center of the component mounted on the designed heat sink.
Thermal grease should be applied properly.