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EBG offers the totally encapsulatedand insulated TO-220 package for low ohmic value and non-inductive design for high frequency and pulsing applications. Ideal use is for power supplies. This seriesis rated at 20 Watts mounted to a heatsink. The special features include: ![]()
| Specifications: •Resistance Range: 0.05W to1MW other values on request •Resistance Tolerance:±1%, ±2%, ±5%, ±10% (0.5% onrequest) •Temperature Coefficient:10W and above, ±50ppm/°C,referenced to 25°C, DR taken at+105°C. Between 1W and 10W,±(100ppm + 0.002W)/°C,referenced to 25°C, DR taken at+105°C •Max. Operating Voltage: 350V •Dielectric Strength: 1,800V AC •Power Rating:20W at 25°C. Depends uponcase temperature. See DeratingCurve. •Insulation Resistance:10GW min. •Momentary Overload:2 times rated power with appliedvoltage not to exceed 1.5 timesmaximum continuous operatingvoltage for 5 seconds, DR ± (0.3%+ 0.001W) max. •Load Life:MIL-R-39009, 2,000 hours atrated power, DR ±(1.0% +0.001W). •Moisture Resistance:MIL-Std-202, Method 106, DR±(0.5% + 0.001W) max. •Thermal Shock:MIL-Std-202, Method 107, Cond. F,DR ±(0.3% + 0.001W) max. •Terminal Strength:MIL-Std-202, Method 211, Cond. A(Pull Test) 2.4N, DR ±(0.2% + 0.001W)max. •Vibration, High Frequency:MIL-Std-202, Method 204, Cond. D,DR ±(0.2% + 0.001W) max. •Lead Material: Tinned Copper • For pulse power details, please see page 27 (datasheet UXP-300)! | ![]() ![]() Derating (thermal resistance): 0.16W/°K (6.25°K/W). Without a heatsink, when in free air at 25°C, the LXP20 is rated for 3W. By using the element with a snap-on heat sink the resistor is rated for 5W. Derating for temp. above 25°C is 0.018W/ °K. The case temperature is to be used for the definitiion of the applied power limit. The case temperature measurement must be made with a thermocouple contacting the center of the component mounted on the designed heat sink. Thermal grease should be applied properly. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||