Series HXP200, SOT227

Series HXP 200, SOT 227

200 Watt Power Resistor in the "ISOTOP" Power Device

Due to a non inductive design theseelements are ideally suited for high frequency andpulse load applications. By direct mounting on aheatsink significant cost advantages can berealized. The type HXP can be supplied in a 2-terminal or 4-terminal version. Even doubleresistors are available. Main applications are:Variable speed Drives, Power Supplies, ControlDevices, Telecom, Robotics, Motor Controls andother switching designs.Specials and custom designedcomponents on request.

Version 5: ohmic value between contact 2 and 4 = 3mW

Specifications
•Resistance Range: 0.1W to1MW
•Tolerance: ±1%, 2%, 5%,10%
•Temperature coefficient:±50, ±100ppm, ±250ppm (at+105°C ref. to +25°C)
•Max. Work.Voltage: 500V (upto 1,000V on special request)
•Power Rating at 85°C:200W (see derating)
•Partial Discharge:up to 2,000Vrms/80 pC
•Voltage Proof:Dielectric Strength up to4,000V DC against ground
•Protectionclass:acc. to IEC 950/CSA22.2 950/M-89 and EN 60950.88: 2
•Heat Resistance to CoolingPlate: Rth <0.35 K/W
•Capacitance/Mass: 45pF
•Working Temp. Range:-55°C to +155°C
•Max. Torque for Base Plate(static): 1.5 Nm M4 screws
•Max. Torque for Contacts(static): 1.3 Nm. M4 screws
• For pulse power details, pleasesee page 27 (datasheet UXP-300)!

Derating (thermal resistance):2.86W/°K (0.35°K/W).

Best results can be reached by using athermal transfer compound with a heatconductivity of better than 1W/mK

Dim.	Millimeter		Inches
Dim.	Min.	Max.	Min.	Max.
A	31.0	31.7	1.220	1.249
B	7.8	8.2	0.307	0.323
C	4.1	4.3	0.162	0.169
D	4.0	- -	0.158	- -
E	4.1	4.3	0.162	0.169
F	14.9	15.1	0.587	0.595
G	30.1	30.3	1.186	1.193
H	38.0	38.2	1.497	1.505
J	11.8	12.2	0.465	0.481
K	8.9	9.1	0.351	0.359
L	0.75	0.85	0.030	0.033
M	12.6	12.8	0.496	0.504
N	24.4	25.4	0.960	1.001
O	1.95	2.05	0.077	0.081
P	5.3	- -	0.209	- -

FMCC EUROPE Components and technical solutions for power electronics

FMCC EUROPE
Components and technical solutions for power electronics