FMCC EUROPE
Components and technical solutions for power electronics

EBG offers the SGP series to meetthe requirements of high resistancevalues combined with very high voltagerequirements, while utilizing EBG‘spatented non-inductive design completewith in-process digital trimming to exactvalue.
This series employs our specialMETOXFILM which demonstratesexcellent stability while coveringresistance ranges from 100Ω to 10GΩ,-all at high operating temperatures to225°C. The power ratings and voltageratings are for continuous opera-tion,and have all been pre-tested to theserequirements for steady stateperformance, as well as momentaryoverload conditions.
A summary of the features of the SGPseries are:
•Resistance values up to 10GΩ
•Resistance tolerance from ± 0.1% to ±10%
•Temperature Coefficient:80ppm/°C
•Maximum continuous OperatingVoltage to 48,000 V
•Life Stability:Typical ±0.02% per 1,000 hours
•Maximum operating temp. up to+225°

CVoltages up to 60% higher than thetable values may be obtained in specialorder by adding “S“ to the modeldesignation.
EBG‘s special patented (USPatent-Nr.4,859,981) non-inductive constructionoffers an outstanding advantage overother techniques. The designincorporates a unique method of DIGI-TAL TRIMMING to value. Other lessdesirable methods include an “analog“method of abrading and removing theresistive material, frequently resulting ina weak section. EBG‘s patented processavoids this potential problem.

 Specifications:
•Resistance Tolerance:Standard: ±1% to ±10%(±2% to ±10% above 1Gohms)(tolerances down to ±0,1% onspecial request)
•Temperature Coefficient:Standard ±80ppm/°C from -15°Cto +105°C, referenced to +25°C
•Voltage Coefficient: see diagram
•Dielectric Strength:1,000VDC
•Insulation Resistance:10GΩ, min.
•Overload/Overvoltage:5 times rated power125°C withapplied voltage not to exceed 1.5times maximum continuousoperating voltage for 5 seconds.Overload/Overvoltage, ∆R 0.5%max.
•Load Life:1,000 hours at 125°C and ratedpower, components with 1% Tol.∆R 0.5% max., extented range(“S“)∆R=0.8% max.
•Moisture Resistance:MIL-Std-202, Method 106, ∆R0.4% max.
•Thermal Shock:MIL-Std-202, Method 107,Cond.C, ∆R 0.25% max.
•Encapsulation:Silicone Conformal
•Lead Material:O.F.H.C. Copper tin plated.